Intel plans stacked circuits in bid to regain chipmaking lead
Technological breakthrough will give US company the upper hand over rivals and help meet changing customer needs
Intel Corporation says it has developed a way to stack its computing circuits on top of one another in a bid to regain the lead in chip manufacturing technology it has lost to rivals such as Taiwan Semiconductor in recent years. Intel, the world’s biggest maker of computing chips for personal computers and data centres, for decades followed Moore’s law, named for Intel co-founder Gordon Moore, by doubling the number of transistors on a chip every two years, thus roughly doubling their performance. But as those transistors have shrunk to just a few nanometre apart, Intel has fallen years behind schedule on its own plans. The company said in July that chips featuring its newest 10-nanonmetre manufacturing technology will not arrive until the holiday shopping season of 2019. In the meantime, most of Intel’s biggest rivals such as Nvidia and Qualcomm long ago quit manufacturing chips and outsourced the work to firms such as TSMC. The Taiwanese firm rolled out its newest generation of ch...
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